Sub-micron patterning of aluminum films by laser ablation

David W. Doerr, Dennis R. Alexander

Research output: Contribution to journalConference article

2 Scopus citations

Abstract

Microfabrication of sub-micron holes on 30 nm thick aluminum films on fused silica was investigated using pulse durations from 300 fs to 6 ns at 400 nm wavelength. Micromachines areas were investigated using atomic force microscopy (AFM) for quality and size of features produced. Ablation diameters less than 400 nm was achieved with all pulse widths. Pulses less than 5 ps removed the films cleanly and left a flat-bottomed crater with no evidence of substrate melting over a wide fluence range.

Original languageEnglish (US)
Pages (from-to)62-67
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3874
StatePublished - Dec 1 1999
EventProceedings of the 1999 Micromachining and Microfabrication Process Technology V - Santa Clara, CA, USA
Duration: Sep 20 1999Sep 22 1999

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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