Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers

Lisha Fan, Yun Shen Zhou, Meng Meng Wang, Jean François Silvain, Yong Feng Lu

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

We demonstrate that femtosecond (fs) laser patterning of Cu can be exploited to realize seed-free deposition of large-area adhesive diamond films on Cu. Fs-laser-induced nanostructures promote diamond nucleation density and result in diamond film formation within a laser fluence window from 2.6 to 3.6 J cm− 2. Diamond films deposited on Cu surfaces prepared outside this window experience either complete film detachment or formation of low-quality ball-like diamond grains. Diamond/substrate interface roughness plays a critical role in controlling diamond quality and adhesion between substrates and diamond films. Large-area adhesive diamond films have been achieved on Cu substrate surfaces that were first modified with fs-laser irradiation and then scribed into grid patterns. The scribed channels function as expansion joints for stress relief. Strain-free diamond films have been achieved by optimizing the grid size. Using fs-laser processing for seed-free deposition of large-area diamond films on Cu is of great significance for diverse applications, such as thermal management and power electronic devices.

Original languageEnglish (US)
Pages (from-to)499-505
Number of pages7
JournalThin Solid Films
Volume636
DOIs
Publication statusPublished - Aug 31 2017

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Keywords

  • Copper
  • Diamond
  • Femtosecond laser processing
  • Thin film

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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