Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers

Lisha Fan, Yun Shen Zhou, Meng Meng Wang, Jean François Silvain, Yong Feng Lu

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

We demonstrate that femtosecond (fs) laser patterning of Cu can be exploited to realize seed-free deposition of large-area adhesive diamond films on Cu. Fs-laser-induced nanostructures promote diamond nucleation density and result in diamond film formation within a laser fluence window from 2.6 to 3.6 J cm− 2. Diamond films deposited on Cu surfaces prepared outside this window experience either complete film detachment or formation of low-quality ball-like diamond grains. Diamond/substrate interface roughness plays a critical role in controlling diamond quality and adhesion between substrates and diamond films. Large-area adhesive diamond films have been achieved on Cu substrate surfaces that were first modified with fs-laser irradiation and then scribed into grid patterns. The scribed channels function as expansion joints for stress relief. Strain-free diamond films have been achieved by optimizing the grid size. Using fs-laser processing for seed-free deposition of large-area diamond films on Cu is of great significance for diverse applications, such as thermal management and power electronic devices.

Original languageEnglish (US)
Pages (from-to)499-505
Number of pages7
JournalThin Solid Films
Volume636
DOIs
StatePublished - Aug 31 2017

Fingerprint

Diamond films
Ultrashort pulses
diamond films
adhesives
Seed
Copper
seeds
Adhesives
Diamond
copper
Diamonds
lasers
diamonds
Laser windows
Substrates
grids
Expansion joints
Stress relief
Laser beam effects
Power electronics

Keywords

  • Copper
  • Diamond
  • Femtosecond laser processing
  • Thin film

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers. / Fan, Lisha; Zhou, Yun Shen; Wang, Meng Meng; Silvain, Jean François; Lu, Yong Feng.

In: Thin Solid Films, Vol. 636, 31.08.2017, p. 499-505.

Research output: Contribution to journalArticle

Fan, Lisha ; Zhou, Yun Shen ; Wang, Meng Meng ; Silvain, Jean François ; Lu, Yong Feng. / Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers. In: Thin Solid Films. 2017 ; Vol. 636. pp. 499-505.
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