Screw dislocation interacting with an interfacial edge crack between two bonded dissimilar piezoelectric wedges

Xiang Fa Wu, Yuris A. Dzenis, Wen Sheng Zou

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

This letter is concerned with an interfacial edge crack in a piezoelectric bimaterial wedge interacting with a screw dislocation under antiplane mechanical and in-plane electric loading. In addition to a discontinuous electric potential across the slip plane, the dislocation is subjected to a line-force and a line-charge at the tip. The out-of-plane displacement and electric potentials are obtained in closed-form based on conformal mapping technique and the solution for the screw dislocation in an infinite piezoelectric bimaterial with a semi-infinite interfacial crack. The intensity factors (IFs) and energy release rate (EER) are obtained explicitly. These solutions can be used as a base for constructing solutions for arbitrary coupled antiplane mechanical and in-plane electrical loadings.

Original languageEnglish (US)
Pages (from-to)L9-L14
JournalInternational Journal of Fracture
Volume117
Issue number3
StatePublished - Oct 1 2002

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Screw Dislocation
Screw dislocations
Wedge
Crack
Cracks
Bimaterial
Electric Potential
Conformal mapping
Energy release rate
Electric potential
Interfacial Crack
Intensity Factor
Energy Release Rate
Line
Conformal Mapping
Dislocation
Slip
Closed-form
Charge
Arbitrary

ASJC Scopus subject areas

  • Computational Mechanics
  • Modeling and Simulation
  • Mechanics of Materials

Cite this

Screw dislocation interacting with an interfacial edge crack between two bonded dissimilar piezoelectric wedges. / Wu, Xiang Fa; Dzenis, Yuris A.; Zou, Wen Sheng.

In: International Journal of Fracture, Vol. 117, No. 3, 01.10.2002, p. L9-L14.

Research output: Contribution to journalArticle

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