Role of metal/matrix interfaces in the thermal management of metal-carbon composites

Jean François Silvian, Jean Marc Heintz, Thomas Guillemet, Yongfeng Lu

Research output: Contribution to conferencePaper

Abstract

The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal expansion coefficient compatible with chip materials still ensuring the reliability of the power modules. In this context, metal matrix composites: carbon fibers, carbon nano fibers and diamond reinforced copper matrix composites among them are considered very promising as a next generation of thermal management materials in power electronic packages. These composites exhibit enhanced thermal properties compared to pure copper combined with lower density. This article presents the fabrication techniques of copper/carbon composite films by powder metallurgy and tape casting and hot-pressing; these films promise to be efficient heat-dissipation layers for power electronic modules. The thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermo-mechanical properties. Interfaces (through novel chemical and processing methods), when selected carefully and processed properly will form the right chemical/mechanical link between copper and carbon enhancing all the desired thermal properties while minimizing the deleterious effect. In this paper, we outline a variety of methods that are system specific that achieve these goals.

Original languageEnglish (US)
Pages1130-1137
Number of pages8
StatePublished - Dec 1 2012
Event31st International Congress on Applications of Lasers and Electro-Optics, ICALEO 2012 - Anaheim, CA, United States
Duration: Sep 23 2012Sep 27 2012

Conference

Conference31st International Congress on Applications of Lasers and Electro-Optics, ICALEO 2012
CountryUnited States
CityAnaheim, CA
Period9/23/129/27/12

Fingerprint

Temperature control
Copper
Carbon
Power electronics
Metals
Composite materials
Thermodynamic properties
Diamond
Carbon films
Powder metallurgy
Composite films
Hot pressing
Heat losses
Tapes
Carbon fibers
Thermal expansion
Diamonds
Thermal conductivity
Casting
Fabrication

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Silvian, J. F., Heintz, J. M., Guillemet, T., & Lu, Y. (2012). Role of metal/matrix interfaces in the thermal management of metal-carbon composites. 1130-1137. Paper presented at 31st International Congress on Applications of Lasers and Electro-Optics, ICALEO 2012, Anaheim, CA, United States.

Role of metal/matrix interfaces in the thermal management of metal-carbon composites. / Silvian, Jean François; Heintz, Jean Marc; Guillemet, Thomas; Lu, Yongfeng.

2012. 1130-1137 Paper presented at 31st International Congress on Applications of Lasers and Electro-Optics, ICALEO 2012, Anaheim, CA, United States.

Research output: Contribution to conferencePaper

Silvian, JF, Heintz, JM, Guillemet, T & Lu, Y 2012, 'Role of metal/matrix interfaces in the thermal management of metal-carbon composites' Paper presented at 31st International Congress on Applications of Lasers and Electro-Optics, ICALEO 2012, Anaheim, CA, United States, 9/23/12 - 9/27/12, pp. 1130-1137.
Silvian JF, Heintz JM, Guillemet T, Lu Y. Role of metal/matrix interfaces in the thermal management of metal-carbon composites. 2012. Paper presented at 31st International Congress on Applications of Lasers and Electro-Optics, ICALEO 2012, Anaheim, CA, United States.
Silvian, Jean François ; Heintz, Jean Marc ; Guillemet, Thomas ; Lu, Yongfeng. / Role of metal/matrix interfaces in the thermal management of metal-carbon composites. Paper presented at 31st International Congress on Applications of Lasers and Electro-Optics, ICALEO 2012, Anaheim, CA, United States.8 p.
@conference{d0251d17c5614916aef7ee862df63388,
title = "Role of metal/matrix interfaces in the thermal management of metal-carbon composites",
abstract = "The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal expansion coefficient compatible with chip materials still ensuring the reliability of the power modules. In this context, metal matrix composites: carbon fibers, carbon nano fibers and diamond reinforced copper matrix composites among them are considered very promising as a next generation of thermal management materials in power electronic packages. These composites exhibit enhanced thermal properties compared to pure copper combined with lower density. This article presents the fabrication techniques of copper/carbon composite films by powder metallurgy and tape casting and hot-pressing; these films promise to be efficient heat-dissipation layers for power electronic modules. The thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermo-mechanical properties. Interfaces (through novel chemical and processing methods), when selected carefully and processed properly will form the right chemical/mechanical link between copper and carbon enhancing all the desired thermal properties while minimizing the deleterious effect. In this paper, we outline a variety of methods that are system specific that achieve these goals.",
author = "Silvian, {Jean Fran{\cc}ois} and Heintz, {Jean Marc} and Thomas Guillemet and Yongfeng Lu",
year = "2012",
month = "12",
day = "1",
language = "English (US)",
pages = "1130--1137",
note = "31st International Congress on Applications of Lasers and Electro-Optics, ICALEO 2012 ; Conference date: 23-09-2012 Through 27-09-2012",

}

TY - CONF

T1 - Role of metal/matrix interfaces in the thermal management of metal-carbon composites

AU - Silvian, Jean François

AU - Heintz, Jean Marc

AU - Guillemet, Thomas

AU - Lu, Yongfeng

PY - 2012/12/1

Y1 - 2012/12/1

N2 - The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal expansion coefficient compatible with chip materials still ensuring the reliability of the power modules. In this context, metal matrix composites: carbon fibers, carbon nano fibers and diamond reinforced copper matrix composites among them are considered very promising as a next generation of thermal management materials in power electronic packages. These composites exhibit enhanced thermal properties compared to pure copper combined with lower density. This article presents the fabrication techniques of copper/carbon composite films by powder metallurgy and tape casting and hot-pressing; these films promise to be efficient heat-dissipation layers for power electronic modules. The thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermo-mechanical properties. Interfaces (through novel chemical and processing methods), when selected carefully and processed properly will form the right chemical/mechanical link between copper and carbon enhancing all the desired thermal properties while minimizing the deleterious effect. In this paper, we outline a variety of methods that are system specific that achieve these goals.

AB - The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal expansion coefficient compatible with chip materials still ensuring the reliability of the power modules. In this context, metal matrix composites: carbon fibers, carbon nano fibers and diamond reinforced copper matrix composites among them are considered very promising as a next generation of thermal management materials in power electronic packages. These composites exhibit enhanced thermal properties compared to pure copper combined with lower density. This article presents the fabrication techniques of copper/carbon composite films by powder metallurgy and tape casting and hot-pressing; these films promise to be efficient heat-dissipation layers for power electronic modules. The thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermo-mechanical properties. Interfaces (through novel chemical and processing methods), when selected carefully and processed properly will form the right chemical/mechanical link between copper and carbon enhancing all the desired thermal properties while minimizing the deleterious effect. In this paper, we outline a variety of methods that are system specific that achieve these goals.

UR - http://www.scopus.com/inward/record.url?scp=84893136170&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84893136170&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84893136170

SP - 1130

EP - 1137

ER -