Plastic ball grid array reflow using a fast-modulated CW laser

Daming Liu, Yongfeng Lu, Yuan Yuan, Tao Chen, Lalith Prematilleke

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Plastic ball grid array reflow using a fast-modulated CW laser is studied. A CW/Q-switched Nd:YAG laser is modified to work in the fast-modulated CW mode. Sn-Pb eutectic solder balls with a diameter of 760 μm and Au-Ni-Cu solder pads are used in the study. By varying the laser power and the laser-on time, respectively, the solderable parameter region of laser reflow for the solder balls and the solder pads is obtained. Shear strength tests are also performed to find out the optimal reflow parameters. The measured shear strength is higher than 1500 gf, with the maximum value over 1900 gf. An energy equilibrium model is proposed to compare the solderable region predicted theoretically with the experimental results and to estimate the average temperatures of solder joint under the given experimental conditions.

Original languageEnglish (US)
Pages (from-to)177-182
Number of pages6
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume40
Issue number1
DOIs
StatePublished - Jan 1 2001

Fingerprint

Ball grid arrays
Continuous wave lasers
solders
Soldering alloys
balls
plastics
grids
Plastics
Lasers
lasers
shear strength
Shear strength
Q switched lasers
eutectics
Eutectics
YAG lasers
estimates

Keywords

  • Laser reflow
  • Plastic ball grid array
  • Sn-Pb eutectic solder ball

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Plastic ball grid array reflow using a fast-modulated CW laser. / Liu, Daming; Lu, Yongfeng; Yuan, Yuan; Chen, Tao; Prematilleke, Lalith.

In: Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, Vol. 40, No. 1, 01.01.2001, p. 177-182.

Research output: Contribution to journalArticle

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