Planarization of high aspect ratio p-i-n diode pillar arrays for blanket electrical contacts

L. F. Voss, Q. Shao, C. E. Reinhardt, R. T. Graff, A. M. Conway, R. J. Nikolić, Nirmalendu Deo, Chin Li Cheung

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Two planarization techniques for high aspect ratio three dimensional pillar structured p-i-n diodes have been developed in order to enable a continuous coating of metal on the top of the structures. The first technique allows for coating of structures with topography through the use of a planarizing photoresist followed by reactive ion etch-back to expose the tops of the pillar structure. The second technique also utilizes photoresist but instead allows for planarization of a structure in which the pillars are filled and coated with a conformal coating by matching the etch rate of the photoresist to the underlying layers. These techniques enable deposition using either sputtering or electron beam evaporation of metal films to allow for electrical contact to the tops of the underlying pillar structure. These processes have potential applications for many devices comprised of three dimensional high aspect ratio structures.

Original languageEnglish (US)
Pages (from-to)916-920
Number of pages5
JournalJournal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
Volume28
Issue number5
DOIs
StatePublished - Sep 2010

Fingerprint

p-i-n diodes
blankets
Photoresists
high aspect ratio
photoresists
Aspect ratio
electric contacts
Diodes
coatings
Coatings
Metals
metal films
Topography
Sputtering
Electron beams
topography
Evaporation
sputtering
evaporation
electron beams

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Process Chemistry and Technology
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Planarization of high aspect ratio p-i-n diode pillar arrays for blanket electrical contacts. / Voss, L. F.; Shao, Q.; Reinhardt, C. E.; Graff, R. T.; Conway, A. M.; Nikolić, R. J.; Deo, Nirmalendu; Cheung, Chin Li.

In: Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics, Vol. 28, No. 5, 09.2010, p. 916-920.

Research output: Contribution to journalArticle

Voss, L. F. ; Shao, Q. ; Reinhardt, C. E. ; Graff, R. T. ; Conway, A. M. ; Nikolić, R. J. ; Deo, Nirmalendu ; Cheung, Chin Li. / Planarization of high aspect ratio p-i-n diode pillar arrays for blanket electrical contacts. In: Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 2010 ; Vol. 28, No. 5. pp. 916-920.
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