Optical modeling of Iridium thin film erosion under oxygen plasma exposure

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The use of ellipsometry and spectroscopic mode to monitor oxygen plasma etching of iridium was analyzed. It was observed that the etching of film of iridium was done on fused silica substrates using an electron cyclotron resonance plasma source. The nanoscale atomic mixing and index of refraction grading were also analyzed. It was found that the iridium films were etched upon plasma irradiation using spectroscopic psi and delta data.

Original languageEnglish (US)
Pages (from-to)2177-2181
Number of pages5
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume22
Issue number5
DOIs
StatePublished - Sep 1 2004

Fingerprint

Iridium
oxygen plasma
iridium
erosion
Erosion
Oxygen
Plasmas
Thin films
thin films
Electron cyclotron resonance
Plasma sources
Plasma etching
Ellipsometry
plasma etching
Fused silica
electron cyclotron resonance
Refraction
ellipsometry
refraction
Etching

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

Cite this

Optical modeling of Iridium thin film erosion under oxygen plasma exposure. / Yan, Li; Woollam, John A.

In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol. 22, No. 5, 01.09.2004, p. 2177-2181.

Research output: Contribution to journalArticle

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