Optical emission spectrum analyses during pulsed laser deflash of integrated circuit packages

Min Hui Hong, Yongfeng Lu, Qiong Chen

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Optical emission spectrum analysis during Nd:YAG laser deflash of molding compound for integrated circuits (IC) packaging is investigated. Dependence of spectral line and band intensities for SiO molecules, Si excited atoms and ions on laser fluence is measured to study plasma species evolution. Threshold fluences for the spectral line and band appearance are also estimated. Temporally resolved optical emission spectrum analysis shows that the spectral lines and bands appear and recombine at different delay times after laser irradiation. Mechanism for spectral line generation and recombination is found to be attributed to strong collisions among plasma species.

Original languageEnglish (US)
Pages (from-to)6750-6753
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume38
Issue number12 A
StatePublished - Dec 1 1999

Fingerprint

Pulsed lasers
Spectrum analysis
integrated circuits
light emission
line spectra
Integrated circuits
optical spectrum
pulsed lasers
emission spectra
spectral bands
Plasmas
Sheet molding compounds
Lasers
Laser beam effects
spectrum analysis
Time delay
Packaging
fluence
Atoms
Molecules

Keywords

  • IC packages
  • Optical emission spectrum
  • Plasma analysis
  • Pulsed laser deflash

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

@article{2bf96ea09ab94939b8d6615f24ac23ef,
title = "Optical emission spectrum analyses during pulsed laser deflash of integrated circuit packages",
abstract = "Optical emission spectrum analysis during Nd:YAG laser deflash of molding compound for integrated circuits (IC) packaging is investigated. Dependence of spectral line and band intensities for SiO molecules, Si excited atoms and ions on laser fluence is measured to study plasma species evolution. Threshold fluences for the spectral line and band appearance are also estimated. Temporally resolved optical emission spectrum analysis shows that the spectral lines and bands appear and recombine at different delay times after laser irradiation. Mechanism for spectral line generation and recombination is found to be attributed to strong collisions among plasma species.",
keywords = "IC packages, Optical emission spectrum, Plasma analysis, Pulsed laser deflash",
author = "Hong, {Min Hui} and Yongfeng Lu and Qiong Chen",
year = "1999",
month = "12",
day = "1",
language = "English (US)",
volume = "38",
pages = "6750--6753",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Japan Society of Applied Physics",
number = "12 A",

}

TY - JOUR

T1 - Optical emission spectrum analyses during pulsed laser deflash of integrated circuit packages

AU - Hong, Min Hui

AU - Lu, Yongfeng

AU - Chen, Qiong

PY - 1999/12/1

Y1 - 1999/12/1

N2 - Optical emission spectrum analysis during Nd:YAG laser deflash of molding compound for integrated circuits (IC) packaging is investigated. Dependence of spectral line and band intensities for SiO molecules, Si excited atoms and ions on laser fluence is measured to study plasma species evolution. Threshold fluences for the spectral line and band appearance are also estimated. Temporally resolved optical emission spectrum analysis shows that the spectral lines and bands appear and recombine at different delay times after laser irradiation. Mechanism for spectral line generation and recombination is found to be attributed to strong collisions among plasma species.

AB - Optical emission spectrum analysis during Nd:YAG laser deflash of molding compound for integrated circuits (IC) packaging is investigated. Dependence of spectral line and band intensities for SiO molecules, Si excited atoms and ions on laser fluence is measured to study plasma species evolution. Threshold fluences for the spectral line and band appearance are also estimated. Temporally resolved optical emission spectrum analysis shows that the spectral lines and bands appear and recombine at different delay times after laser irradiation. Mechanism for spectral line generation and recombination is found to be attributed to strong collisions among plasma species.

KW - IC packages

KW - Optical emission spectrum

KW - Plasma analysis

KW - Pulsed laser deflash

UR - http://www.scopus.com/inward/record.url?scp=0033310530&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033310530&partnerID=8YFLogxK

M3 - Article

VL - 38

SP - 6750

EP - 6753

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 12 A

ER -