Nucleotide excision repair in the third kingdom

M. Ogrunc, D. F. Becker, S. W. Ragsdale, A. Sancar

Research output: Contribution to journalArticle

32 Citations (Scopus)

Abstract

Nucleotide excision repair, a general repair mechanism for removing DNA damage, is initiated by dual incisions bracketing the lesion. In procaryotes, the dual incisions result in excision of the damage in 12- to 13-nucleotide- long oligomers, and in eucaryotes they result in excision of the damage in the form of 24- to 32-nucleotide-long oligomers. We wished to find out if Archaea perform excision repair. Using cell extracts from Methanobacterium thermoautotrophicum, we found that this organism removes UV-induced (6-4) photoproducts in the form of 10- to 11-mers by incising the sixth to seventh phosphodiester bond 5' to the damage and the fourth phosphodiester bond 3' to the damage.

Original languageEnglish (US)
Pages (from-to)5796-5798
Number of pages3
JournalJournal of bacteriology
Volume180
Issue number21
StatePublished - Nov 7 1998

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DNA Repair
Nucleotides
Methanobacterium
Archaea
Cell Extracts
DNA Damage

ASJC Scopus subject areas

  • Microbiology
  • Molecular Biology

Cite this

Ogrunc, M., Becker, D. F., Ragsdale, S. W., & Sancar, A. (1998). Nucleotide excision repair in the third kingdom. Journal of bacteriology, 180(21), 5796-5798.

Nucleotide excision repair in the third kingdom. / Ogrunc, M.; Becker, D. F.; Ragsdale, S. W.; Sancar, A.

In: Journal of bacteriology, Vol. 180, No. 21, 07.11.1998, p. 5796-5798.

Research output: Contribution to journalArticle

Ogrunc, M, Becker, DF, Ragsdale, SW & Sancar, A 1998, 'Nucleotide excision repair in the third kingdom', Journal of bacteriology, vol. 180, no. 21, pp. 5796-5798.
Ogrunc M, Becker DF, Ragsdale SW, Sancar A. Nucleotide excision repair in the third kingdom. Journal of bacteriology. 1998 Nov 7;180(21):5796-5798.
Ogrunc, M. ; Becker, D. F. ; Ragsdale, S. W. ; Sancar, A. / Nucleotide excision repair in the third kingdom. In: Journal of bacteriology. 1998 ; Vol. 180, No. 21. pp. 5796-5798.
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