New high conductivity lead (Pb)-free conducting adhesives

S. K. Kang, T. Graham, S. Purushothaman, J. Roldan, Ravi F Saraf

Research output: Contribution to conferencePaper

10 Citations (Scopus)

Abstract

Solder interconnection technology is currently in need of alternatives to address environmental issues associated with lead (Pb) abatement, and elimination of fluxes and flux cleaning solvents, and technical challenges related to extending to line pitch assembly. Electrically conducting adhesive technology is one of the alternatives being actively considered in this context. The most common conductive adhesive used today is an epoxy resin filled with fine silver particles. Silver particles provide electrical conduction, while epoxy provides adhesive bonding of the components to a substrate. This material has several limitations such as low electrical conductivity, low joint strength, increase in contact resistance upon thermal cycling, and silver migration. In order to overcome these limitations, a new formulation is proposed based on alternative Pb-free conducting filler powders and tailored polymer resins. This new material provides a metallurgical bonding as well as polymer adhesive bonding leading to an increase in joint strength and in electrical conductivity. Several potential applications of these adhesive materials such as glass-to-board connection in LCD packaging, SMT package assembly to PCB, and direct chip attachment to a high density card are discussed.

Original languageEnglish (US)
Pages177-181
Number of pages5
StatePublished - Jan 1 1995
Externally publishedYes
EventProceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE - Orlando, FL, USA
Duration: May 1 1995May 3 1995

Other

OtherProceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE
CityOrlando, FL, USA
Period5/1/955/3/95

Fingerprint

Adhesives
conductivity
Lead
silver
Silver
electrical conductivity
resin
polymer
Fluxes
Surface mount technology
Thermal cycling
Polymers
Contact resistance
Polychlorinated biphenyls
Liquid crystal displays
environmental issue
Epoxy resins
Printed circuit boards
Soldering alloys
Fillers

ASJC Scopus subject areas

  • Environmental Engineering
  • Waste Management and Disposal
  • Pollution
  • Electrical and Electronic Engineering

Cite this

Kang, S. K., Graham, T., Purushothaman, S., Roldan, J., & Saraf, R. F. (1995). New high conductivity lead (Pb)-free conducting adhesives. 177-181. Paper presented at Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE, Orlando, FL, USA, .

New high conductivity lead (Pb)-free conducting adhesives. / Kang, S. K.; Graham, T.; Purushothaman, S.; Roldan, J.; Saraf, Ravi F.

1995. 177-181 Paper presented at Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE, Orlando, FL, USA, .

Research output: Contribution to conferencePaper

Kang, SK, Graham, T, Purushothaman, S, Roldan, J & Saraf, RF 1995, 'New high conductivity lead (Pb)-free conducting adhesives' Paper presented at Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE, Orlando, FL, USA, 5/1/95 - 5/3/95, pp. 177-181.
Kang SK, Graham T, Purushothaman S, Roldan J, Saraf RF. New high conductivity lead (Pb)-free conducting adhesives. 1995. Paper presented at Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE, Orlando, FL, USA, .
Kang, S. K. ; Graham, T. ; Purushothaman, S. ; Roldan, J. ; Saraf, Ravi F. / New high conductivity lead (Pb)-free conducting adhesives. Paper presented at Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment, ISEE, Orlando, FL, USA, .5 p.
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