Multiscale treatment of thin-film lubrication

Z. B. Wu, D. J. Diestler, X. C. Zeng

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

A multiscale technique that combines an atomistic description of the interfacial (near) region with a coarse-grained (continuum) description of the far regions of the solid substrates is proposed. The new hybrid technique, which represents an advance over a previously proposed dynamically-constrained hybrid atomistic-coarse-grained treatment (Wu et al J. Chem. Phys., 120, 6744, 2004), is applied to a two-dimensional model tribological system comprising planar substrates sandwiching a monolayer film. Shear-stress profiles (shear stress versus strain) computed by the new hybrid technique are in excellent agreement with "exact" profiles (i.e. those computed treating the whole system at the atomic scale).

Original languageEnglish (US)
Pages (from-to)811-815
Number of pages5
JournalMolecular Simulation
Volume31
Issue number12
DOIs
StatePublished - Oct 15 2005

Fingerprint

Lubrication
lubrication
shear stress
Thin Films
Shear stress
Shear Stress
Thin films
Substrates
thin films
profiles
two dimensional models
Substrate
Monolayers
continuums
Continuum
Profile
Model

Keywords

  • Coarse-grained
  • Film
  • Interface
  • Lubrication
  • Multiscale

ASJC Scopus subject areas

  • Chemistry(all)
  • Information Systems
  • Modeling and Simulation
  • Chemical Engineering(all)
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Multiscale treatment of thin-film lubrication. / Wu, Z. B.; Diestler, D. J.; Zeng, X. C.

In: Molecular Simulation, Vol. 31, No. 12, 15.10.2005, p. 811-815.

Research output: Contribution to journalArticle

Wu, Z. B. ; Diestler, D. J. ; Zeng, X. C. / Multiscale treatment of thin-film lubrication. In: Molecular Simulation. 2005 ; Vol. 31, No. 12. pp. 811-815.
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