Micromachining of at cut quartz using 50 femtosecond laser pulses

David W. Doerr, Dennis R. Alexander

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Slots are micromachined in 75 μm thick AT cut crystalline quartz samples using 50 femtosecond laser pulses in a vacuum of 10 mTorr. The processed area is examined by optical and scanning electron microscope to determine the cut quality at the laser entrance and exit sides and also depth of cuts. Cuts with a high quality laser entrance side without microcracking could be obtained for fluence ranges from 2.5-13 J/cm2 while microcracking around the cuts is observed at 16 J/cm2 Damage on the exit side of the sample was observed for fluences above 2.5 J/cm2 within a distance of 50 μm from the center of the cut and running parallel to the cut. This may be related to stress developed during cutting.

Original languageEnglish (US)
Title of host publicationPICALO 2004 - 1st Pacific International Conference on Applications of Laser and Optics, Conference Proceedings
Pages6-9
Number of pages4
Publication statusPublished - Dec 1 2004
EventPICALO 2004 - 1st Pacific International Conference on Applications of Laser and Optics - Melbourne, VIC, Australia
Duration: Apr 19 2004Apr 21 2004

Publication series

NamePICALO 2004 - 1st Pacific International Conference on Applications of Laser and Optics, Conference Proceedings

Conference

ConferencePICALO 2004 - 1st Pacific International Conference on Applications of Laser and Optics
CountryAustralia
CityMelbourne, VIC
Period4/19/044/21/04

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ASJC Scopus subject areas

  • Geochemistry and Petrology
  • Electrical and Electronic Engineering

Cite this

Doerr, D. W., & Alexander, D. R. (2004). Micromachining of at cut quartz using 50 femtosecond laser pulses. In PICALO 2004 - 1st Pacific International Conference on Applications of Laser and Optics, Conference Proceedings (pp. 6-9). (PICALO 2004 - 1st Pacific International Conference on Applications of Laser and Optics, Conference Proceedings).