Metal-organic frameworks capable of healing at low temperatures

Ziguang Chen, Gonghua Wang, Zhanping Xu, Hui Li, Alexandre Dhôtel, Xiao Cheng Zeng, Banglin Chen, Jean Marc Saiter, Li Tan

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Filling crystalline gaps with small molecules can drive interfacial healing between anisotropic solids. Sufficient mobility from these fillers allows the process to happen at a low temperature of -56 °C. Mended bulk crystals show modulus leap from 4 to 12 GPa and hardness from 400 to 1000 MPa.

Original languageEnglish (US)
Pages (from-to)6106-6111
Number of pages6
JournalAdvanced Materials
Volume25
Issue number42
DOIs
StatePublished - Nov 13 2013

Fingerprint

Fillers
Metals
Hardness
Crystalline materials
Crystals
Molecules
Temperature

Keywords

  • healing
  • interfacial binding
  • low temperatures
  • metal-organic frameworks
  • welding

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Chen, Z., Wang, G., Xu, Z., Li, H., Dhôtel, A., Zeng, X. C., ... Tan, L. (2013). Metal-organic frameworks capable of healing at low temperatures. Advanced Materials, 25(42), 6106-6111. https://doi.org/10.1002/adma.201302471

Metal-organic frameworks capable of healing at low temperatures. / Chen, Ziguang; Wang, Gonghua; Xu, Zhanping; Li, Hui; Dhôtel, Alexandre; Zeng, Xiao Cheng; Chen, Banglin; Saiter, Jean Marc; Tan, Li.

In: Advanced Materials, Vol. 25, No. 42, 13.11.2013, p. 6106-6111.

Research output: Contribution to journalArticle

Chen, Z, Wang, G, Xu, Z, Li, H, Dhôtel, A, Zeng, XC, Chen, B, Saiter, JM & Tan, L 2013, 'Metal-organic frameworks capable of healing at low temperatures', Advanced Materials, vol. 25, no. 42, pp. 6106-6111. https://doi.org/10.1002/adma.201302471
Chen, Ziguang ; Wang, Gonghua ; Xu, Zhanping ; Li, Hui ; Dhôtel, Alexandre ; Zeng, Xiao Cheng ; Chen, Banglin ; Saiter, Jean Marc ; Tan, Li. / Metal-organic frameworks capable of healing at low temperatures. In: Advanced Materials. 2013 ; Vol. 25, No. 42. pp. 6106-6111.
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