Mechanical, geometrical, and electrical characterization of silicon membranes for open stencil masks

E. Sossna, A. Degen, I. W. Rangelow, M. Drzik, P. Hudek, T. E. Tiwald, J. A. Woollam

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A study was carried out to show quantitative and qualitative determination of the mechanical properties of the true thickness, thickness variation (morphology), and electrical conductivity. An interferometric method of precise thickness variation measurement of silicon membranes was presented. By evaluating the intensity distribution throughout the area of the membrane image using defocusing, it was possible to determine the absolute values of membrane thickness variations.

Original languageEnglish (US)
Pages (from-to)2665-2670
Number of pages6
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume19
Issue number6
DOIs
StatePublished - Nov 1 2001

Fingerprint

Masks
masks
membranes
Membranes
Silicon
silicon
Thickness measurement
defocusing
Mechanical properties
mechanical properties
electrical resistivity
Electric Conductivity

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Mechanical, geometrical, and electrical characterization of silicon membranes for open stencil masks. / Sossna, E.; Degen, A.; Rangelow, I. W.; Drzik, M.; Hudek, P.; Tiwald, T. E.; Woollam, J. A.

In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 19, No. 6, 01.11.2001, p. 2665-2670.

Research output: Contribution to journalArticle

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AU - Tiwald, T. E.

AU - Woollam, J. A.

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