Laser reflow plastic ball grid array

Daming Liu, Tao Chen, Yuan Yuan, Yong Feng Lu, Minghui Hong, Ryan Goh

Research output: Contribution to journalArticle

2 Scopus citations


A modified fast-modulated CW Nd:YAG is used to reflow plastic ball grid array (PBGA). Sn-Pb eutectic solder balls with a diameter of 760 μm and Au-Ni-Cu solder pads are used in the study. Shear strength tests are performed to find out the optimal reflow parameters. An energy equilibrium model is proposed to estimate the average temperatures of solder joint under the given experimental conditions. Based on the experimental and theoretical results, a parameter range for laser reflow of the 760 μm SnPb eutectic solder balls is proposed.

Original languageEnglish (US)
Pages (from-to)363-366
Number of pages4
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - Jan 1 2002



  • Laser reflow
  • Plastic ball grid array
  • Sn-Pb eutectic solder ball

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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