Laser reflow plastic ball grid array

Daming Liu, Tao Chen, Yuan Yuan, Yong Feng Lu, Minghui Hong, Ryan Goh

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A modified fast-modulated CW Nd:YAG is used to reflow plastic ball grid array (PBGA). Sn-Pb eutectic solder balls with a diameter of 760 μm and Au-Ni-Cu solder pads are used in the study. Shear strength tests are performed to find out the optimal reflow parameters. An energy equilibrium model is proposed to estimate the average temperatures of solder joint under the given experimental conditions. Based on the experimental and theoretical results, a parameter range for laser reflow of the 760 μm SnPb eutectic solder balls is proposed.

Original languageEnglish (US)
Pages (from-to)363-366
Number of pages4
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4426
DOIs
StatePublished - Jan 1 2002

Fingerprint

Ball grid arrays
solders
Soldering alloys
balls
Plastics
Ball
plastics
grids
Laser
Grid
Lasers
eutectics
Eutectics
Solder Joint
lasers
Nd:YAG
Shear Strength
Equilibrium Model
Energy Model
Optimal Parameter

Keywords

  • Laser reflow
  • Plastic ball grid array
  • Sn-Pb eutectic solder ball

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Laser reflow plastic ball grid array. / Liu, Daming; Chen, Tao; Yuan, Yuan; Lu, Yong Feng; Hong, Minghui; Goh, Ryan.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 4426, 01.01.2002, p. 363-366.

Research output: Contribution to journalArticle

Liu, Daming ; Chen, Tao ; Yuan, Yuan ; Lu, Yong Feng ; Hong, Minghui ; Goh, Ryan. / Laser reflow plastic ball grid array. In: Proceedings of SPIE - The International Society for Optical Engineering. 2002 ; Vol. 4426. pp. 363-366.
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