Laser-induced removal of flash from heat sinks in integrated circuit packages

W. D. Song, M. H. Hong, S. M. Huang, S. Y. Chan, Yongfeng Lu, T. C. Chong

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Laser-induced removal of flash from heat sinks in integrated circuit (IC) packages has been studied. It is found that flash can be effectively removed from heat sinks in plastic IC packages by laser deflashing. An optical microscope, an α-step surface profiler and X-ray photoelectron spectroscopy are used to analyze the deflashing efficiency. Laser deflashing of IC packages is based on laser ablation of flash materials. With an increase of laser fluence, the ablation rate increases. The laser fluence is selected between the ablation threshold of flash materials and that of heat-sink materials. An acoustic wave is generated by laser ablation of flash materials. Acoustic wave detection is used to monitor the surface cleanness during laser deflashing and to determine the ablation threshold of flash materials.

Original languageEnglish (US)
Pages (from-to)519-523
Number of pages5
JournalApplied Physics A: Materials Science and Processing
Volume75
Issue number4
DOIs
StatePublished - Oct 1 2002

Fingerprint

heat sinks
Heat sinks
integrated circuits
Integrated circuits
flash
Lasers
Ablation
ablation
lasers
Laser ablation
laser ablation
fluence
Acoustic waves
thresholds
acoustics
optical microscopes
Microscopes
plastics
X ray photoelectron spectroscopy
photoelectron spectroscopy

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)

Cite this

Laser-induced removal of flash from heat sinks in integrated circuit packages. / Song, W. D.; Hong, M. H.; Huang, S. M.; Chan, S. Y.; Lu, Yongfeng; Chong, T. C.

In: Applied Physics A: Materials Science and Processing, Vol. 75, No. 4, 01.10.2002, p. 519-523.

Research output: Contribution to journalArticle

Song, W. D. ; Hong, M. H. ; Huang, S. M. ; Chan, S. Y. ; Lu, Yongfeng ; Chong, T. C. / Laser-induced removal of flash from heat sinks in integrated circuit packages. In: Applied Physics A: Materials Science and Processing. 2002 ; Vol. 75, No. 4. pp. 519-523.
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