Laser-induced dry cleaning in air—a new surface cleaning technology in lieu of carbon fluorochloride (Cfc) solvents

Yongfeng Lu, Yoshinobu Aoyagi

Research output: Contribution to journalArticle

27 Citations (Scopus)

Abstract

Surface contaminations are removed by laser irradiation with pulse output and short wavelength. It is a new dry cleaning process to remove surface organic contaminations without using ultrasonic cleaning with carbon fluorochloride (CFC) and other organic solvents. This provides a new dry process to clean different substrate sur-faces and can take the place of conventional wet cleaning processes such as ultrasonic cleaning with CFC and other organic solvents. The mechanisms of laser cleaning may include laser photodecomposition, laser ablation and surface vibration due to the impact of laser pulse.

Original languageEnglish (US)
Pages (from-to)L430-L433
JournalJapanese Journal of Applied Physics
Volume33
Issue number3
DOIs
StatePublished - Jan 1 1994

Fingerprint

Dry cleaning
Surface cleaning
Ultrasonic cleaning
cleaning
ultrasonic cleaning
Organic solvents
Carbon
Lasers
carbon
Cleaning
Contamination
lasers
contamination
Laser ablation
Laser beam effects
photodecomposition
Laser pulses
pulses
laser ablation
Wavelength

Keywords

  • CFC-free cleaning
  • Dry process
  • Fingerprint removal
  • Laser cleaning
  • Magnetic head cleaning
  • Metal surface cleaning
  • Surface cleaning
  • UV pulse laser

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Laser-induced dry cleaning in air—a new surface cleaning technology in lieu of carbon fluorochloride (Cfc) solvents. / Lu, Yongfeng; Aoyagi, Yoshinobu.

In: Japanese Journal of Applied Physics, Vol. 33, No. 3, 01.01.1994, p. L430-L433.

Research output: Contribution to journalArticle

@article{137e1af2cf124809b0e452fe3ecd77a7,
title = "Laser-induced dry cleaning in air—a new surface cleaning technology in lieu of carbon fluorochloride (Cfc) solvents",
abstract = "Surface contaminations are removed by laser irradiation with pulse output and short wavelength. It is a new dry cleaning process to remove surface organic contaminations without using ultrasonic cleaning with carbon fluorochloride (CFC) and other organic solvents. This provides a new dry process to clean different substrate sur-faces and can take the place of conventional wet cleaning processes such as ultrasonic cleaning with CFC and other organic solvents. The mechanisms of laser cleaning may include laser photodecomposition, laser ablation and surface vibration due to the impact of laser pulse.",
keywords = "CFC-free cleaning, Dry process, Fingerprint removal, Laser cleaning, Magnetic head cleaning, Metal surface cleaning, Surface cleaning, UV pulse laser",
author = "Yongfeng Lu and Yoshinobu Aoyagi",
year = "1994",
month = "1",
day = "1",
doi = "10.1143/JJAP.33.L430",
language = "English (US)",
volume = "33",
pages = "L430--L433",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Japan Society of Applied Physics",
number = "3",

}

TY - JOUR

T1 - Laser-induced dry cleaning in air—a new surface cleaning technology in lieu of carbon fluorochloride (Cfc) solvents

AU - Lu, Yongfeng

AU - Aoyagi, Yoshinobu

PY - 1994/1/1

Y1 - 1994/1/1

N2 - Surface contaminations are removed by laser irradiation with pulse output and short wavelength. It is a new dry cleaning process to remove surface organic contaminations without using ultrasonic cleaning with carbon fluorochloride (CFC) and other organic solvents. This provides a new dry process to clean different substrate sur-faces and can take the place of conventional wet cleaning processes such as ultrasonic cleaning with CFC and other organic solvents. The mechanisms of laser cleaning may include laser photodecomposition, laser ablation and surface vibration due to the impact of laser pulse.

AB - Surface contaminations are removed by laser irradiation with pulse output and short wavelength. It is a new dry cleaning process to remove surface organic contaminations without using ultrasonic cleaning with carbon fluorochloride (CFC) and other organic solvents. This provides a new dry process to clean different substrate sur-faces and can take the place of conventional wet cleaning processes such as ultrasonic cleaning with CFC and other organic solvents. The mechanisms of laser cleaning may include laser photodecomposition, laser ablation and surface vibration due to the impact of laser pulse.

KW - CFC-free cleaning

KW - Dry process

KW - Fingerprint removal

KW - Laser cleaning

KW - Magnetic head cleaning

KW - Metal surface cleaning

KW - Surface cleaning

KW - UV pulse laser

UR - http://www.scopus.com/inward/record.url?scp=0028403175&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0028403175&partnerID=8YFLogxK

U2 - 10.1143/JJAP.33.L430

DO - 10.1143/JJAP.33.L430

M3 - Article

VL - 33

SP - L430-L433

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 3

ER -