Laser assisted Pd seeding for electroless plating on SiO2

A. G. Schrott, B. Braren, R. Saraf

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

Excimer laser pulses with wavelengths of 248 and 308 nm were used to selectively seed Pd on SiO2 surfaces, making them suitable for electroless plating. This novel seeding process for insulating materials is accomplished with the sample immersed in the seeding solution, and occurs only on the areas of the substrate that are illuminated (through the liquid) by the laser light. The Pd content of the seeded samples increased with the number of pulses, but was rather independent of repetition rate. The deposition rate showed a dependence with wavelength consistent with a defect driven mechanism for electron excitation through the band gap of SiO2. These electrons then reduce the Pd ions in the solution in contact with the surface.

Original languageEnglish (US)
Pages (from-to)1582-1584
Number of pages3
JournalApplied Physics Letters
Volume64
Issue number12
DOIs
StatePublished - Dec 1 1994

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inoculation
plating
pulses
wavelengths
insulation
excimer lasers
lasers
seeds
repetition
electrons
defects
liquids
excitation
ions

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Laser assisted Pd seeding for electroless plating on SiO2. / Schrott, A. G.; Braren, B.; Saraf, R.

In: Applied Physics Letters, Vol. 64, No. 12, 01.12.1994, p. 1582-1584.

Research output: Contribution to journalArticle

Schrott, A. G. ; Braren, B. ; Saraf, R. / Laser assisted Pd seeding for electroless plating on SiO2. In: Applied Physics Letters. 1994 ; Vol. 64, No. 12. pp. 1582-1584.
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