Laser-assisted nanoscale material processing (invited)

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Laser material processing demonstrated its significance in many areas such as microelectronics, data storage, photonics and nanotechnology, since versatile laser sources provide flexible and unique energy source for precise control of material processing. With current laser technology, a short wavelength down to X-ray range and a short pulse duration down to femtosecond range can be achieved. The extreme conditions created by laser irradiation have provided strong impact on material research. To achieve nanoscale laser material machining and processing, we need to overcome the diffraction limit of the laser wavelengths. Recently, different approaches have been explored to overcome the diffraction limit and to achieve feature sizes down to 10 nm order, way beyond the diffraction limits. This paper will provide an overview in the areas of laser-based nanoscale machining and processing, including the author's own research experience on laser-assisted scanning probe microscope, superfbcusing by optical resonance in spherical particles, laser nanoimprinting, laser synthesis of quantum dots, laser annealing of ultrashow pn junctions, nanometer-order film thickness detection using rotational Raman spectroscopy, and laser cleaning of nanoparticles.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME Heat Transfer Division 2005
Pages1025-1034
Number of pages10
Edition2
DOIs
StatePublished - Dec 1 2005
Event2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005 - Orlando, FL, United States
Duration: Nov 5 2005Nov 11 2005

Publication series

NameAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Number2
Volume376 HTD
ISSN (Print)0272-5673

Conference

Conference2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005
CountryUnited States
CityOrlando, FL
Period11/5/0511/11/05

Fingerprint

Lasers
Processing
Diffraction
Machining
Laser materials processing
Quantum dot lasers
Wavelength
Laser beam effects
Nanotechnology
Microelectronics
Photonics
Film thickness
Raman spectroscopy
Cleaning
Microscopes
Annealing
Nanoparticles
Scanning
Data storage equipment
X rays

ASJC Scopus subject areas

  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

Cite this

Lu, Y. (2005). Laser-assisted nanoscale material processing (invited). In Proceedings of the ASME Heat Transfer Division 2005 (2 ed., pp. 1025-1034). (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; Vol. 376 HTD, No. 2). https://doi.org/10.1115/IMECE2005-83047

Laser-assisted nanoscale material processing (invited). / Lu, Yongfeng.

Proceedings of the ASME Heat Transfer Division 2005. 2. ed. 2005. p. 1025-1034 (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; Vol. 376 HTD, No. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lu, Y 2005, Laser-assisted nanoscale material processing (invited). in Proceedings of the ASME Heat Transfer Division 2005. 2 edn, American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, no. 2, vol. 376 HTD, pp. 1025-1034, 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005, Orlando, FL, United States, 11/5/05. https://doi.org/10.1115/IMECE2005-83047
Lu Y. Laser-assisted nanoscale material processing (invited). In Proceedings of the ASME Heat Transfer Division 2005. 2 ed. 2005. p. 1025-1034. (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; 2). https://doi.org/10.1115/IMECE2005-83047
Lu, Yongfeng. / Laser-assisted nanoscale material processing (invited). Proceedings of the ASME Heat Transfer Division 2005. 2. ed. 2005. pp. 1025-1034 (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; 2).
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