Laser applications in integrated circuits and photonics packaging

Yongfeng Lu, L. P. Li, K. Mendu, J. Shi

Research output: Contribution to journalConference article

1 Citation (Scopus)

Abstract

Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash from heat sinks and lead wires of IC packages, laser singulation of BGA (ball grid array) and CSP (chip scale packages), laser reflow of solder ball on GBA, laser peeling for CSP, laser marking on packages and on Si wafers. Laser nanoimprinting of self-assembled nanoparticles has been recently developed to fabricate hemispherical cavity arrays on semiconductor surfaces. This process has the potential applications in fabrication and packaging of photonic devices such as waveguides and optical interconnections. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to be taken into account. Monitoring of laser-induced plasma has been used to understand and to control the processes involved in these applications. Numerical simulations can provide useful information on process analysis and optimization.

Original languageEnglish (US)
Pages (from-to)427-440
Number of pages14
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5339
DOIs
StatePublished - Oct 25 2004
EventPhoton Processing in Microelectronics and Photonics III - San Jose, CA, United States
Duration: Jan 26 2004Jan 29 2004

Fingerprint

Laser applications
laser applications
Packaging
Integrated Circuits
Photonics
packaging
integrated circuits
Integrated circuits
photonics
Laser
Lasers
lasers
Chip scale packages
balls
Ball
Chip
chips
Monitoring
Laser Processing
Ball grid arrays

Keywords

  • Laser bumping
  • Laser deflash
  • Laser mold cleaning
  • Laser nanoimprinting
  • Laser packaging
  • Laser reflow
  • Laser singulation
  • Laser tagging
  • Self-assembled particles

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Laser applications in integrated circuits and photonics packaging. / Lu, Yongfeng; Li, L. P.; Mendu, K.; Shi, J.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 5339, 25.10.2004, p. 427-440.

Research output: Contribution to journalConference article

@article{b43c961d74254d6b9148e441baa18707,
title = "Laser applications in integrated circuits and photonics packaging",
abstract = "Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash from heat sinks and lead wires of IC packages, laser singulation of BGA (ball grid array) and CSP (chip scale packages), laser reflow of solder ball on GBA, laser peeling for CSP, laser marking on packages and on Si wafers. Laser nanoimprinting of self-assembled nanoparticles has been recently developed to fabricate hemispherical cavity arrays on semiconductor surfaces. This process has the potential applications in fabrication and packaging of photonic devices such as waveguides and optical interconnections. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to be taken into account. Monitoring of laser-induced plasma has been used to understand and to control the processes involved in these applications. Numerical simulations can provide useful information on process analysis and optimization.",
keywords = "Laser bumping, Laser deflash, Laser mold cleaning, Laser nanoimprinting, Laser packaging, Laser reflow, Laser singulation, Laser tagging, Self-assembled particles",
author = "Yongfeng Lu and Li, {L. P.} and K. Mendu and J. Shi",
year = "2004",
month = "10",
day = "25",
doi = "10.1117/12.531758",
language = "English (US)",
volume = "5339",
pages = "427--440",
journal = "Proceedings of SPIE - The International Society for Optical Engineering",
issn = "0277-786X",
publisher = "SPIE",

}

TY - JOUR

T1 - Laser applications in integrated circuits and photonics packaging

AU - Lu, Yongfeng

AU - Li, L. P.

AU - Mendu, K.

AU - Shi, J.

PY - 2004/10/25

Y1 - 2004/10/25

N2 - Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash from heat sinks and lead wires of IC packages, laser singulation of BGA (ball grid array) and CSP (chip scale packages), laser reflow of solder ball on GBA, laser peeling for CSP, laser marking on packages and on Si wafers. Laser nanoimprinting of self-assembled nanoparticles has been recently developed to fabricate hemispherical cavity arrays on semiconductor surfaces. This process has the potential applications in fabrication and packaging of photonic devices such as waveguides and optical interconnections. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to be taken into account. Monitoring of laser-induced plasma has been used to understand and to control the processes involved in these applications. Numerical simulations can provide useful information on process analysis and optimization.

AB - Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash from heat sinks and lead wires of IC packages, laser singulation of BGA (ball grid array) and CSP (chip scale packages), laser reflow of solder ball on GBA, laser peeling for CSP, laser marking on packages and on Si wafers. Laser nanoimprinting of self-assembled nanoparticles has been recently developed to fabricate hemispherical cavity arrays on semiconductor surfaces. This process has the potential applications in fabrication and packaging of photonic devices such as waveguides and optical interconnections. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to be taken into account. Monitoring of laser-induced plasma has been used to understand and to control the processes involved in these applications. Numerical simulations can provide useful information on process analysis and optimization.

KW - Laser bumping

KW - Laser deflash

KW - Laser mold cleaning

KW - Laser nanoimprinting

KW - Laser packaging

KW - Laser reflow

KW - Laser singulation

KW - Laser tagging

KW - Self-assembled particles

UR - http://www.scopus.com/inward/record.url?scp=5444269918&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=5444269918&partnerID=8YFLogxK

U2 - 10.1117/12.531758

DO - 10.1117/12.531758

M3 - Conference article

VL - 5339

SP - 427

EP - 440

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

SN - 0277-786X

ER -