Laser applications in integrated circuit packaging

Y. F. Lu, W. D. Song, Z. M. Ren, C. W. An, K. D. Ye, D. M. Liu, W. J. Wang, M. H. Hong, T. C. Chong

Research output: Contribution to journalConference article

2 Scopus citations

Abstract

Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash from heat sinks and lead wires of IC packages, laser singulation of BGA (ball grid array) and CSP (chip scale packages), laser reflow of solder ball on GBA, laser marking on packages and on Si wafers. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to be taken into account. Monitoring of laser-induced plasma and laser induced acoustic wave has been used to understand and to control the processes involved in these applications.

Original languageEnglish (US)
Pages (from-to)581-591
Number of pages11
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4637
DOIs
StatePublished - Jan 1 2002
EventPhoton Processing in Microelectronics and Photonics - San Jose, CA, United States
Duration: Jan 21 2002Jan 24 2002

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Keywords

  • Laser bumping
  • Laser deflash
  • Laser mold cleaning
  • Laser packaging
  • Laser reflow
  • Laser singulation
  • Laser tagging

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Lu, Y. F., Song, W. D., Ren, Z. M., An, C. W., Ye, K. D., Liu, D. M., Wang, W. J., Hong, M. H., & Chong, T. C. (2002). Laser applications in integrated circuit packaging. Proceedings of SPIE - The International Society for Optical Engineering, 4637, 581-591. https://doi.org/10.1117/12.470667