Improved adhesion of polycrystalline diamond films on copper/carbon composite surfaces due to in situ formation of mechanical gripping sites

C. Azina, M. M. Wang, E. Feuillet, L. Constantin, B. Mortaigne, P. M. Geffroy, Y. F. Lu, J. F. Silvain

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Diamond coatings are investigated for thermal management, wear protection and corrosion resistance in harsh environments. In power electronic industries, copper (Cu), which shows high thermal conductivity, is considered as a promising substrate for diamond based heat-spread materials. However, the coefficient of thermal expansion (CTE) mismatch between diamond and Cu induces thermo-mechanical stresses that affect the integrity of the diamond-Cu assembly. In fact, diamond films deposited on Cu substrates tend to peel-off upon cooling due to the compressive stresses present at the diamond-Cu interface. This investigation is focused on the growth of polycrystalline diamond thin films onto Cu/carbon fibers (CFs) composite materials, using combustion flame chemical vapor deposition (CVD). It has been found that increased CF content in the Cu/CF materials leads to a reduced CTE improving, hence, the adhesion between the diamond film and the Cu/CF substrate and reduces Cu/CF-diamond interfacial residual thermal stresses. At a CF content of 40% in volume, the residual thermal stress of the diamond film deposited on the Cu/CF composite is lower than that on bare Cu and adapted with CVD diamond growth. Naturally engineered composite surfaces have enhanced the adhesion of the diamond film on the composite substrate via mechanical interlocking.

Original languageEnglish (US)
Pages (from-to)1-7
Number of pages7
JournalSurface and Coatings Technology
Volume321
DOIs
StatePublished - Jul 15 2017

Fingerprint

Diamond
Diamond films
diamond films
Carbon fibers
carbon fibers
Copper
Diamonds
adhesion
Carbon
Adhesion
diamonds
copper
composite materials
carbon
Composite materials
Substrates
fiber composites
Thermal stress
thermal stresses
Thermal expansion

Keywords

  • Combustion CVD
  • Diamond deposition
  • MMC
  • Mechanical gripping
  • Surface engineering

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Improved adhesion of polycrystalline diamond films on copper/carbon composite surfaces due to in situ formation of mechanical gripping sites. / Azina, C.; Wang, M. M.; Feuillet, E.; Constantin, L.; Mortaigne, B.; Geffroy, P. M.; Lu, Y. F.; Silvain, J. F.

In: Surface and Coatings Technology, Vol. 321, 15.07.2017, p. 1-7.

Research output: Contribution to journalArticle

Azina, C. ; Wang, M. M. ; Feuillet, E. ; Constantin, L. ; Mortaigne, B. ; Geffroy, P. M. ; Lu, Y. F. ; Silvain, J. F. / Improved adhesion of polycrystalline diamond films on copper/carbon composite surfaces due to in situ formation of mechanical gripping sites. In: Surface and Coatings Technology. 2017 ; Vol. 321. pp. 1-7.
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