Femtosecond laser drilling of high aspect ratio 1 μm holes in silicon

Dennis R. Alexander, Brian Mihulka, David Doerr

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

There is a need in many scientific and manufacturing processes to drill small diameter holes with high aspect ratios in both brittle materials as well as metals. Femtosecond lasers operating at 795 nm or frequency doubled to 400 nm provide a unique tool for carrying out these processes. In this work, the femtosecond laser nanomachining facilities at the University of Nebraska is used to drill 1 μm holes in Si/SiO2 with aspect ratios > 8. The quality of the cut and the small nanoparticles are discussed. Two methods of eliminating the unwanted particles around the cut are discussed.

Original languageEnglish (US)
Pages (from-to)383-393
Number of pages11
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4760
Issue numberI
DOIs
StatePublished - Jan 1 2002
EventHigh-Power Laser Ablation IV - Taos, United States
Duration: Apr 22 2002Apr 26 2002

Fingerprint

laser drilling
Femtosecond Laser
Drilling
Silicon
high aspect ratio
Ultrashort pulses
Aspect Ratio
Aspect ratio
brittle materials
Brittle Materials
SiO2
silicon
Brittleness
lasers
Nanoparticles
aspect ratio
manufacturing
Manufacturing
Metals
nanoparticles

Keywords

  • Femtosecond
  • Laser ablation
  • Lasers
  • Micromachining
  • Nanomachining
  • Semiconductor processing

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Femtosecond laser drilling of high aspect ratio 1 μm holes in silicon. / Alexander, Dennis R.; Mihulka, Brian; Doerr, David.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 4760, No. I, 01.01.2002, p. 383-393.

Research output: Contribution to journalConference article

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