Electronic excitations of the YBa2Cu3O7-x superconductor

A study by transmission electron-energy-loss spectroscopy with an electron microprobe

C. H. Chen, L. F. Schneemeyer, Sy-Hwang Liou, M. Hong, J. Kwo, H. S. Chen, J. V. Waszczak

Research output: Contribution to journalArticle

20 Citations (Scopus)

Abstract

Interband and core-level transitions and plasmon resonance in the high-temperature oxide superconductor YBa2Cu3O7-x were studied by transmission electron-energy-loss spectroscopy using an electron microprobe 1/45-10 in size. Both single-crystal and polycrystalline ceramic samples have been examined. No significant change in electronic structure was observed at the grain boundaries. A 13.5-eV interband-transition peak was found to be sensitive to damages created by ion-beam bombardment.

Original languageEnglish (US)
Pages (from-to)9780-9783
Number of pages4
JournalPhysical Review B
Volume37
Issue number16
DOIs
StatePublished - Jan 1 1988

Fingerprint

Oxide superconductors
Core levels
High temperature superconductors
Electron energy loss spectroscopy
Electron transitions
Ion beams
Superconducting materials
Electronic structure
Grain boundaries
energy dissipation
Single crystals
electron energy
Electrons
electronics
spectroscopy
excitation
bombardment
electrons
grain boundaries
ion beams

ASJC Scopus subject areas

  • Condensed Matter Physics

Cite this

Electronic excitations of the YBa2Cu3O7-x superconductor : A study by transmission electron-energy-loss spectroscopy with an electron microprobe. / Chen, C. H.; Schneemeyer, L. F.; Liou, Sy-Hwang; Hong, M.; Kwo, J.; Chen, H. S.; Waszczak, J. V.

In: Physical Review B, Vol. 37, No. 16, 01.01.1988, p. 9780-9783.

Research output: Contribution to journalArticle

Chen, C. H. ; Schneemeyer, L. F. ; Liou, Sy-Hwang ; Hong, M. ; Kwo, J. ; Chen, H. S. ; Waszczak, J. V. / Electronic excitations of the YBa2Cu3O7-x superconductor : A study by transmission electron-energy-loss spectroscopy with an electron microprobe. In: Physical Review B. 1988 ; Vol. 37, No. 16. pp. 9780-9783.
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