Deposition of dense and smooth Ti films using ECR plasma-assisted magnetron sputtering

Lei Zhang, L. Q. Shi, Z. J. He, B. Zhang, Y. F. Lu, A. Liu, B. Y. Wang

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

We report high quality Ti films grown in a novel electron cyclotron resonance (ECR) plasma-assisted magnetron sputtering (PMS) deposition system. The films are compared with films deposited by conventional direct current (DC) magnetron sputtering. Using ECR-PMS, the argon plasma bombardment energy and Ti film deposition rate can be controlled separately, with the substrate bias voltage under feedback control. Results from SEM, AFM, XRD and PAS (scanning electron microscopy, atomic force microscopy, X-ray diffraction and positron annihilation spectroscopy) show that the properties of Ti films prepared by ECR-PMS are greatly improved compared with conventional sputtering. SEM and AFM confirmed that ECR-PMS Ti films have a dense, smooth, mirror-like surface. Increasing the substrate bias of the ECR plasma from - 23 V to - 120 V while keeping a fixed sputtering bias voltage of - 40 V, the intensity of the (100) reflection of Ti film was a little strengthened, but (002) remained strongly preferred orientation. The XRD peak broadening of ECR-PMS Ti films is more than for conventional magnetron sputtering, due to grain refinement induced by Ar ion bombardment. Doppler broadening of PAS analysis reveals that the Ti films have fewer vacancy defects compared with films prepared by the conventional magnetron.

Original languageEnglish (US)
Pages (from-to)3356-3360
Number of pages5
JournalSurface and Coatings Technology
Volume203
Issue number22
DOIs
StatePublished - Aug 15 2009

Fingerprint

Electron cyclotron resonance
electron cyclotron resonance
Magnetron sputtering
magnetron sputtering
Plasmas
PAS
atomic force microscopy
Bias voltage
Scanning electron microscopy
scanning electron microscopy
Sputtering
bombardment
sputtering
Positron annihilation spectroscopy
Argon
Grain refinement
Doppler effect
argon plasma
electric potential
Substrates

Keywords

  • ECR plasma
  • Magnetron sputtering
  • Ti thin film

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Deposition of dense and smooth Ti films using ECR plasma-assisted magnetron sputtering. / Zhang, Lei; Shi, L. Q.; He, Z. J.; Zhang, B.; Lu, Y. F.; Liu, A.; Wang, B. Y.

In: Surface and Coatings Technology, Vol. 203, No. 22, 15.08.2009, p. 3356-3360.

Research output: Contribution to journalArticle

Zhang, Lei ; Shi, L. Q. ; He, Z. J. ; Zhang, B. ; Lu, Y. F. ; Liu, A. ; Wang, B. Y. / Deposition of dense and smooth Ti films using ECR plasma-assisted magnetron sputtering. In: Surface and Coatings Technology. 2009 ; Vol. 203, No. 22. pp. 3356-3360.
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