Comment on "Steady-state temperature profile for a thin-film resistor under bias" [J. Appl. Phys. 72, 3862 (1992)]

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Abstract

This comment is to point out that the temperature dependence of the thermal conductivity should be taken into account in computing the temperature distribution in substrate material (such as silicon) with temperature-dependent thermal conductivity. Ignoring the temperature dependence of the thermal conductivity will lead to a large error in the calculated results.

Original languageEnglish (US)
Number of pages1
JournalJournal of Applied Physics
Volume74
Issue number8
DOIs
StatePublished - Dec 1 1993

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resistors
temperature profiles
thermal conductivity
thin films
temperature dependence
temperature distribution
silicon
temperature

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

@article{0ac055c9e75540acae4f58d362601a43,
title = "Comment on {"}Steady-state temperature profile for a thin-film resistor under bias{"} [J. Appl. Phys. 72, 3862 (1992)]",
abstract = "This comment is to point out that the temperature dependence of the thermal conductivity should be taken into account in computing the temperature distribution in substrate material (such as silicon) with temperature-dependent thermal conductivity. Ignoring the temperature dependence of the thermal conductivity will lead to a large error in the calculated results.",
author = "Lu, {Yong Feng}",
year = "1993",
month = "12",
day = "1",
doi = "10.1063/1.355308",
language = "English (US)",
volume = "74",
journal = "Journal of Applied Physics",
issn = "0021-8979",
publisher = "American Institute of Physics Publising LLC",
number = "8",

}

TY - JOUR

T1 - Comment on "Steady-state temperature profile for a thin-film resistor under bias" [J. Appl. Phys. 72, 3862 (1992)]

AU - Lu, Yong Feng

PY - 1993/12/1

Y1 - 1993/12/1

N2 - This comment is to point out that the temperature dependence of the thermal conductivity should be taken into account in computing the temperature distribution in substrate material (such as silicon) with temperature-dependent thermal conductivity. Ignoring the temperature dependence of the thermal conductivity will lead to a large error in the calculated results.

AB - This comment is to point out that the temperature dependence of the thermal conductivity should be taken into account in computing the temperature distribution in substrate material (such as silicon) with temperature-dependent thermal conductivity. Ignoring the temperature dependence of the thermal conductivity will lead to a large error in the calculated results.

UR - http://www.scopus.com/inward/record.url?scp=36448998716&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=36448998716&partnerID=8YFLogxK

U2 - 10.1063/1.355308

DO - 10.1063/1.355308

M3 - Review article

AN - SCOPUS:36448998716

VL - 74

JO - Journal of Applied Physics

JF - Journal of Applied Physics

SN - 0021-8979

IS - 8

ER -