Cleaning force in laser cleaning of silicon substrates

W. D. Song, Y. F. Lu, K. D. Ye, C. K. Tee, M. H. Hong, D. M. Liu, T. S. Low

Research output: Contribution to journalConference article

7 Citations (Scopus)

Abstract

A laser cleaning model was established for removal of non-absorbing particles from an absorbing solid surface by taking adhesion force and cleaning force into account. The cleaning force per unit area due to laser-induced thermal expansion of a substrate surface is γE AT(0, t), where γ, E, and δT(0, t) are the linear thermal expansion coefficient, the elastic modulus and temperature rise at the substrate surface, respectively. The cleaning condition and threshold fluence can be obtained by comparing the cleaning force and the adhesion force. The theoretical analysis shows that cleaning force increases with increasing laser fluence, deducing the pulse duration, or decreasing laser wavelength, which leads to a higher cleaning efficiency at higher laser fluence, smaller pulse duration or shorter laser wavelength. The experimental results show that the cleaning threshold fluence for laser removal of quartz particles from silicon surfaces is about 135 mJ/ cm2, which is in good consistency with the theoretical threshold fluence of 120 mJ/cm2. With increasing laser fluence, the cleaning efficiency increases, which has been predicted by our theoretical analysis.

Original languageEnglish (US)
Pages (from-to)158-165
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3184
DOIs
StatePublished - Dec 1 1997
EventMicroelectronic Packaging and Laser Processing - Singapore, Singapore
Duration: Jun 25 1997Jun 25 1997

Fingerprint

Cleaning
Silicon
cleaning
Substrate
Laser
Lasers
fluence
silicon
Substrates
lasers
Thermal Expansion
Adhesion
Thermal expansion
thresholds
thermal expansion
Laser pulses
Theoretical Analysis
pulse duration
adhesion
Wavelength

Keywords

  • Cleaning force
  • Laser cleaning
  • Silicon substrate
  • Thermal stress

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Cleaning force in laser cleaning of silicon substrates. / Song, W. D.; Lu, Y. F.; Ye, K. D.; Tee, C. K.; Hong, M. H.; Liu, D. M.; Low, T. S.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 3184, 01.12.1997, p. 158-165.

Research output: Contribution to journalConference article

Song, W. D. ; Lu, Y. F. ; Ye, K. D. ; Tee, C. K. ; Hong, M. H. ; Liu, D. M. ; Low, T. S. / Cleaning force in laser cleaning of silicon substrates. In: Proceedings of SPIE - The International Society for Optical Engineering. 1997 ; Vol. 3184. pp. 158-165.
@article{8ba8eab72b0348fd9059e264b5764989,
title = "Cleaning force in laser cleaning of silicon substrates",
abstract = "A laser cleaning model was established for removal of non-absorbing particles from an absorbing solid surface by taking adhesion force and cleaning force into account. The cleaning force per unit area due to laser-induced thermal expansion of a substrate surface is γE AT(0, t), where γ, E, and δT(0, t) are the linear thermal expansion coefficient, the elastic modulus and temperature rise at the substrate surface, respectively. The cleaning condition and threshold fluence can be obtained by comparing the cleaning force and the adhesion force. The theoretical analysis shows that cleaning force increases with increasing laser fluence, deducing the pulse duration, or decreasing laser wavelength, which leads to a higher cleaning efficiency at higher laser fluence, smaller pulse duration or shorter laser wavelength. The experimental results show that the cleaning threshold fluence for laser removal of quartz particles from silicon surfaces is about 135 mJ/ cm2, which is in good consistency with the theoretical threshold fluence of 120 mJ/cm2. With increasing laser fluence, the cleaning efficiency increases, which has been predicted by our theoretical analysis.",
keywords = "Cleaning force, Laser cleaning, Silicon substrate, Thermal stress",
author = "Song, {W. D.} and Lu, {Y. F.} and Ye, {K. D.} and Tee, {C. K.} and Hong, {M. H.} and Liu, {D. M.} and Low, {T. S.}",
year = "1997",
month = "12",
day = "1",
doi = "10.1117/12.280569",
language = "English (US)",
volume = "3184",
pages = "158--165",
journal = "Proceedings of SPIE - The International Society for Optical Engineering",
issn = "0277-786X",
publisher = "SPIE",

}

TY - JOUR

T1 - Cleaning force in laser cleaning of silicon substrates

AU - Song, W. D.

AU - Lu, Y. F.

AU - Ye, K. D.

AU - Tee, C. K.

AU - Hong, M. H.

AU - Liu, D. M.

AU - Low, T. S.

PY - 1997/12/1

Y1 - 1997/12/1

N2 - A laser cleaning model was established for removal of non-absorbing particles from an absorbing solid surface by taking adhesion force and cleaning force into account. The cleaning force per unit area due to laser-induced thermal expansion of a substrate surface is γE AT(0, t), where γ, E, and δT(0, t) are the linear thermal expansion coefficient, the elastic modulus and temperature rise at the substrate surface, respectively. The cleaning condition and threshold fluence can be obtained by comparing the cleaning force and the adhesion force. The theoretical analysis shows that cleaning force increases with increasing laser fluence, deducing the pulse duration, or decreasing laser wavelength, which leads to a higher cleaning efficiency at higher laser fluence, smaller pulse duration or shorter laser wavelength. The experimental results show that the cleaning threshold fluence for laser removal of quartz particles from silicon surfaces is about 135 mJ/ cm2, which is in good consistency with the theoretical threshold fluence of 120 mJ/cm2. With increasing laser fluence, the cleaning efficiency increases, which has been predicted by our theoretical analysis.

AB - A laser cleaning model was established for removal of non-absorbing particles from an absorbing solid surface by taking adhesion force and cleaning force into account. The cleaning force per unit area due to laser-induced thermal expansion of a substrate surface is γE AT(0, t), where γ, E, and δT(0, t) are the linear thermal expansion coefficient, the elastic modulus and temperature rise at the substrate surface, respectively. The cleaning condition and threshold fluence can be obtained by comparing the cleaning force and the adhesion force. The theoretical analysis shows that cleaning force increases with increasing laser fluence, deducing the pulse duration, or decreasing laser wavelength, which leads to a higher cleaning efficiency at higher laser fluence, smaller pulse duration or shorter laser wavelength. The experimental results show that the cleaning threshold fluence for laser removal of quartz particles from silicon surfaces is about 135 mJ/ cm2, which is in good consistency with the theoretical threshold fluence of 120 mJ/cm2. With increasing laser fluence, the cleaning efficiency increases, which has been predicted by our theoretical analysis.

KW - Cleaning force

KW - Laser cleaning

KW - Silicon substrate

KW - Thermal stress

UR - http://www.scopus.com/inward/record.url?scp=0001501812&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0001501812&partnerID=8YFLogxK

U2 - 10.1117/12.280569

DO - 10.1117/12.280569

M3 - Conference article

AN - SCOPUS:0001501812

VL - 3184

SP - 158

EP - 165

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

SN - 0277-786X

ER -