Audible acoustic wave real-time monitoring in laser processing of microelectronic materials

M. H. Hong, Y. F. Lu, W. D. Song, D. M. Liu, T. S. Low

Research output: Contribution to journalConference article

6 Citations (Scopus)

Abstract

Audible acoustic wave generation during KrF excimer laser processing of microelectronic materials Si, Cu and Al is investigated. It is found that amplitude of the acoustic wave is closely related to laser pulse number and laser fluence. Due to the laser cleaning of surface contamination, the amplitude reduces to a steady level with laser irradiation up to a pulse number of 10. The first peak-to-peak amplitude of the acoustic wave at the steady condition is used to evaluate laser interaction with the materials. The amplitude analysis shows that there exists a threshold fluence. For laser fluence lower than the threshold, the amplitude is zero. For laser fluence higher than the threshold, the amplitude increases with laser fluence. Threshold fluences are 1.1, 1.35 and 1.2 J/cm2 for Si, Cu and Al respectively. It also shows that the increase of the amplitude starts to saturate for laser fluence higher than 10 J/cm2. According to ablation rate measurement, these thresholds of fluences are the same as the ablation thresholds of the materials. Saturation of amplitude increase is due to plasma shielding effect during the laser ablation of the materials. Theoretical calculation agrees well with the experimental results. Acoustic wave measurement provides a simple method to detect the threshold fluences of laser ablation and plasma shielding. By proper calibration, it can also be used as a real-time measurement of laser ablation rate. By applying appropriate pulse number, the laser processing of microelectronic materials can be controlled in-situ.

Original languageEnglish (US)
Pages (from-to)148-157
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3184
DOIs
StatePublished - Dec 1 1997
EventMicroelectronic Packaging and Laser Processing - Singapore, Singapore
Duration: Jun 25 1997Jun 25 1997

Fingerprint

Laser Processing
Acoustic Waves
microelectronics
Microelectronics
fluence
Acoustic waves
Monitoring
Laser
Real-time
acoustics
Lasers
Processing
lasers
thresholds
Laser Ablation
Laser ablation
laser ablation
Ablation
Shielding
Laser pulses

Keywords

  • Audible acoustic wave
  • Laser ablation
  • Laser materials interaction
  • Real-time monitoring

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Audible acoustic wave real-time monitoring in laser processing of microelectronic materials. / Hong, M. H.; Lu, Y. F.; Song, W. D.; Liu, D. M.; Low, T. S.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 3184, 01.12.1997, p. 148-157.

Research output: Contribution to journalConference article

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