Angular effect in laser removal of spherical silica particles from silicon wafers

Y. W. Zheng, Y. F. Lu, W. D. Song

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

In this study, laser cleaning efficiencies to remove 2.5 μm particles have been investigated with different incident angles ranging from 0° to 60°. It is found that when the laser light irradiated normally to the substrate surface, the particle could be removed most efficiently. In this direction, the cleaning efficiency was also most sensitive to the light intensity. A sharp drop of cleaning efficiency occurred with a small change of the incident angle. Theoretical calculations based on the Lorentz-Mie theory and an accurate solution of the boundary problem, indicate that the light intensity near the contacting point is sensitive to the incident angle even though the incident light is uniform.

Original languageEnglish (US)
Pages (from-to)59-63
Number of pages5
JournalJournal of Applied Physics
Volume90
Issue number1
DOIs
StatePublished - Jul 1 2001

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cleaning
wafers
silicon dioxide
luminous intensity
silicon
lasers
Mie scattering

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Angular effect in laser removal of spherical silica particles from silicon wafers. / Zheng, Y. W.; Lu, Y. F.; Song, W. D.

In: Journal of Applied Physics, Vol. 90, No. 1, 01.07.2001, p. 59-63.

Research output: Contribution to journalArticle

@article{86f8d6f4d698413b8ea3257103a52961,
title = "Angular effect in laser removal of spherical silica particles from silicon wafers",
abstract = "In this study, laser cleaning efficiencies to remove 2.5 μm particles have been investigated with different incident angles ranging from 0° to 60°. It is found that when the laser light irradiated normally to the substrate surface, the particle could be removed most efficiently. In this direction, the cleaning efficiency was also most sensitive to the light intensity. A sharp drop of cleaning efficiency occurred with a small change of the incident angle. Theoretical calculations based on the Lorentz-Mie theory and an accurate solution of the boundary problem, indicate that the light intensity near the contacting point is sensitive to the incident angle even though the incident light is uniform.",
author = "Zheng, {Y. W.} and Lu, {Y. F.} and Song, {W. D.}",
year = "2001",
month = "7",
day = "1",
doi = "10.1063/1.1359154",
language = "English (US)",
volume = "90",
pages = "59--63",
journal = "Journal of Applied Physics",
issn = "0021-8979",
publisher = "American Institute of Physics Publising LLC",
number = "1",

}

TY - JOUR

T1 - Angular effect in laser removal of spherical silica particles from silicon wafers

AU - Zheng, Y. W.

AU - Lu, Y. F.

AU - Song, W. D.

PY - 2001/7/1

Y1 - 2001/7/1

N2 - In this study, laser cleaning efficiencies to remove 2.5 μm particles have been investigated with different incident angles ranging from 0° to 60°. It is found that when the laser light irradiated normally to the substrate surface, the particle could be removed most efficiently. In this direction, the cleaning efficiency was also most sensitive to the light intensity. A sharp drop of cleaning efficiency occurred with a small change of the incident angle. Theoretical calculations based on the Lorentz-Mie theory and an accurate solution of the boundary problem, indicate that the light intensity near the contacting point is sensitive to the incident angle even though the incident light is uniform.

AB - In this study, laser cleaning efficiencies to remove 2.5 μm particles have been investigated with different incident angles ranging from 0° to 60°. It is found that when the laser light irradiated normally to the substrate surface, the particle could be removed most efficiently. In this direction, the cleaning efficiency was also most sensitive to the light intensity. A sharp drop of cleaning efficiency occurred with a small change of the incident angle. Theoretical calculations based on the Lorentz-Mie theory and an accurate solution of the boundary problem, indicate that the light intensity near the contacting point is sensitive to the incident angle even though the incident light is uniform.

UR - http://www.scopus.com/inward/record.url?scp=0035395109&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035395109&partnerID=8YFLogxK

U2 - 10.1063/1.1359154

DO - 10.1063/1.1359154

M3 - Article

AN - SCOPUS:0035395109

VL - 90

SP - 59

EP - 63

JO - Journal of Applied Physics

JF - Journal of Applied Physics

SN - 0021-8979

IS - 1

ER -