A novel multilayer circuit process using YBa2Cu3Ox/SrTiO3 thin films patterned by wet etching and ion milling

H. Q. Li, R. H. Ono, L. R. Vale, D. A. Rudman, Sy-Hwang Liou

Research output: Contribution to journalArticle

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Abstract

A process combining hydrofluoric acid (HF) and Ar+ ion milling has been used to make YBa2Cu3Ox/SrTiO3/YBa 2Cu3Ox(YBCO/STO/YBCO) multilayer test circuits. Low-angle steps can be readily etched in STO and YBCO films with this process. YBCO lines crossing 5° steps have about the same critical temperature Tc (89-90 K) and critical current density Jc (>1×106 A/cm2 at 86 K) as lines on planar surfaces. Via connections have the same Tc as other circuit components and adequate critical currents for most circuit designs.

Original languageEnglish (US)
Pages (from-to)2752-2754
Number of pages3
JournalApplied Physics Letters
Volume69
Issue number18
DOIs
StatePublished - Oct 28 1996

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A novel multilayer circuit process using YBa2Cu3Ox/SrTiO3 thin films patterned by wet etching and ion milling. / Li, H. Q.; Ono, R. H.; Vale, L. R.; Rudman, D. A.; Liou, Sy-Hwang.

In: Applied Physics Letters, Vol. 69, No. 18, 28.10.1996, p. 2752-2754.

Research output: Contribution to journalArticle

Li, H. Q. ; Ono, R. H. ; Vale, L. R. ; Rudman, D. A. ; Liou, Sy-Hwang. / A novel multilayer circuit process using YBa2Cu3Ox/SrTiO3 thin films patterned by wet etching and ion milling. In: Applied Physics Letters. 1996 ; Vol. 69, No. 18. pp. 2752-2754.
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