A micro-mechanics investigation on the bonding strength of heteroepitaxical film or strip on a hard substrate

Research output: Contribution to journalArticle

Abstract

The bonding strength of deposited metallic thin films or strips on a hard substrate is investigated through micro-strength tests and micro-mechanics analyses. The combination of Ti:W-Au/Cu deposited directly on SiO2/Si substrate was taken as an example in the experiments conducted. Investigations and analyses resulted in a general model concerning the separation mechanism of thin ductile films from a hard brittle substrate. This separation model leads to some systematic methods of improving strip-substrate interconnection strength. Besides strip-substrate adhesion and internal stresses, strip stiffness turns out to be a key factor for the bonding strength of such a system. Hardening processes such as post-deposition heat treatment and work-hardening are proved to be effective in strengthening the bonding strength. These investigations reveal a principle of mechanical compatibility concerning interface micro-deformation. Instead of thin and flexible strips, thick and rigid strips have better compatibility with a hard substrate if the bonded combination is subjected to mechanical loading rather than thermal loading. As far as interface stresses are concerned, a stress distribution strategy is proposed based on the same principle. This original understanding will help to improve common bonding strength problems of various interconnection structures and materials combinations in manufacturing processes.

Original languageEnglish (US)
Pages (from-to)201-207
Number of pages7
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume117
Issue number3
DOIs
StatePublished - Jan 1 1995

Fingerprint

Micromechanics
Substrates
Metallic films
Strengthening (metal)
Strain hardening
Hardening
Stress concentration
Residual stresses
Adhesion
Heat treatment
Stiffness
Thin films
Experiments

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

@article{addb75ca6f7c485ab8f6a746e9740c78,
title = "A micro-mechanics investigation on the bonding strength of heteroepitaxical film or strip on a hard substrate",
abstract = "The bonding strength of deposited metallic thin films or strips on a hard substrate is investigated through micro-strength tests and micro-mechanics analyses. The combination of Ti:W-Au/Cu deposited directly on SiO2/Si substrate was taken as an example in the experiments conducted. Investigations and analyses resulted in a general model concerning the separation mechanism of thin ductile films from a hard brittle substrate. This separation model leads to some systematic methods of improving strip-substrate interconnection strength. Besides strip-substrate adhesion and internal stresses, strip stiffness turns out to be a key factor for the bonding strength of such a system. Hardening processes such as post-deposition heat treatment and work-hardening are proved to be effective in strengthening the bonding strength. These investigations reveal a principle of mechanical compatibility concerning interface micro-deformation. Instead of thin and flexible strips, thick and rigid strips have better compatibility with a hard substrate if the bonded combination is subjected to mechanical loading rather than thermal loading. As far as interface stresses are concerned, a stress distribution strategy is proposed based on the same principle. This original understanding will help to improve common bonding strength problems of various interconnection structures and materials combinations in manufacturing processes.",
author = "Luo, {Y. F.} and Rajurkar, {Kamlakar P}",
year = "1995",
month = "1",
day = "1",
doi = "10.1115/1.2792092",
language = "English (US)",
volume = "117",
pages = "201--207",
journal = "Journal of Electronic Packaging, Transactions of the ASME",
issn = "1043-7398",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "3",

}

TY - JOUR

T1 - A micro-mechanics investigation on the bonding strength of heteroepitaxical film or strip on a hard substrate

AU - Luo, Y. F.

AU - Rajurkar, Kamlakar P

PY - 1995/1/1

Y1 - 1995/1/1

N2 - The bonding strength of deposited metallic thin films or strips on a hard substrate is investigated through micro-strength tests and micro-mechanics analyses. The combination of Ti:W-Au/Cu deposited directly on SiO2/Si substrate was taken as an example in the experiments conducted. Investigations and analyses resulted in a general model concerning the separation mechanism of thin ductile films from a hard brittle substrate. This separation model leads to some systematic methods of improving strip-substrate interconnection strength. Besides strip-substrate adhesion and internal stresses, strip stiffness turns out to be a key factor for the bonding strength of such a system. Hardening processes such as post-deposition heat treatment and work-hardening are proved to be effective in strengthening the bonding strength. These investigations reveal a principle of mechanical compatibility concerning interface micro-deformation. Instead of thin and flexible strips, thick and rigid strips have better compatibility with a hard substrate if the bonded combination is subjected to mechanical loading rather than thermal loading. As far as interface stresses are concerned, a stress distribution strategy is proposed based on the same principle. This original understanding will help to improve common bonding strength problems of various interconnection structures and materials combinations in manufacturing processes.

AB - The bonding strength of deposited metallic thin films or strips on a hard substrate is investigated through micro-strength tests and micro-mechanics analyses. The combination of Ti:W-Au/Cu deposited directly on SiO2/Si substrate was taken as an example in the experiments conducted. Investigations and analyses resulted in a general model concerning the separation mechanism of thin ductile films from a hard brittle substrate. This separation model leads to some systematic methods of improving strip-substrate interconnection strength. Besides strip-substrate adhesion and internal stresses, strip stiffness turns out to be a key factor for the bonding strength of such a system. Hardening processes such as post-deposition heat treatment and work-hardening are proved to be effective in strengthening the bonding strength. These investigations reveal a principle of mechanical compatibility concerning interface micro-deformation. Instead of thin and flexible strips, thick and rigid strips have better compatibility with a hard substrate if the bonded combination is subjected to mechanical loading rather than thermal loading. As far as interface stresses are concerned, a stress distribution strategy is proposed based on the same principle. This original understanding will help to improve common bonding strength problems of various interconnection structures and materials combinations in manufacturing processes.

UR - http://www.scopus.com/inward/record.url?scp=0029371312&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029371312&partnerID=8YFLogxK

U2 - 10.1115/1.2792092

DO - 10.1115/1.2792092

M3 - Article

VL - 117

SP - 201

EP - 207

JO - Journal of Electronic Packaging, Transactions of the ASME

JF - Journal of Electronic Packaging, Transactions of the ASME

SN - 1043-7398

IS - 3

ER -